发明名称 |
Lead-free solder balls and method for the production thereof |
摘要 |
Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by weight of Cu, and a balance of Sn, and they have a diameter of from 0.05 mm to 1.0 mm. The solder balls can be produced by forming a molten alloy having the above-described composition into solidified balls having a diameter of from 0.05 mm to 1.0 mm using the surface tension of the molten alloy.
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申请公布号 |
US2003003011(A1) |
申请公布日期 |
2003.01.02 |
申请号 |
US20020170408 |
申请日期 |
2002.06.14 |
申请人 |
KATO RIKIYA;NOMOTO SHINICHI;OKADA HIROSHI |
发明人 |
KATO RIKIYA;NOMOTO SHINICHI;OKADA HIROSHI |
分类号 |
B22F9/08;B23K35/02;B23K35/26;B23K35/40;C22C1/04;C22C13/00;H05K3/34;(IPC1-7):B23K35/12 |
主分类号 |
B22F9/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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