| 摘要 |
An electronic component having an electrode structure to increase an allowance positional deviation in a mounting process as well as a method and a structure for mounting a semiconductor device are provided. The semiconductor device (5) includes, on electrodes (4), connection materials (3, 9) connecting the semiconductor device (5) and a substrate (6). The connection materials include a composite connection material (9) formed of a core (1) and a conductor (2) covering the core, the core having an a low modulus of elasticity at room temperature smaller than that of the conductor at room temperature, and a single-layer connection material (3) formed of a conductor. <IMAGE> |
