Electronic component comprises a plastic housing having islands arranged on the lower side of the housing in a matrix

摘要

Electronic component comprises a plastic housing having islands (3) of a structured system support (4). The islands are arranged on the lower side (5) of the housing in a matrix (6) and have chip islands (8) on which a semiconductor chip is arranged, and contact islands (7) having bond connections (9) on their upper sides (24) and external contact surfaces (11). An Independent claim is also included for a process for the production of an electronic component.