Mikromechanischer Massenflusssensor und Verfahren zu dessen Herstellung

摘要

The invention relates to a mass flow sensor comprising a layer construction on the top side of a silicon substrate (1) and comprising at least one heating element (8) that is structured out of a conductive layer in the layer construction. According to the invention, the thermal insulation between the heating element (8) and the silicon substrate (1) is effected by a silicon dioxide block (5), which is produced underneath the heating element (8) either in the layer construction on the silicon substrate (1) or in the top side of the silicon substrate (1). This enables the sensor to be produced in a surface micromechanical manner, that is, without involving wafer rear side processes.