| 发明名称 |
Light emitting diode having a transparent substrate and a method for manufacturing the same |
| 摘要 |
A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
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| 申请公布号 |
US2003003613(A1) |
申请公布日期 |
2003.01.02 |
| 申请号 |
US20020683959 |
申请日期 |
2002.03.06 |
| 申请人 |
HSIEH MIN-HSUN;CHUANG KEUN-RU;WEY SHANE-SHYAN;LU CHIH-CHIANG;JOU MING-JIUNN;SUNG SHU-WEN;LIU CHIA-CHENG;HUANG CHAO-NIEN |
发明人 |
HSIEH MIN-HSUN;CHUANG KEUN-RU;WEY SHANE-SHYAN;LU CHIH-CHIANG;JOU MING-JIUNN;SUNG SHU-WEN;LIU CHIA-CHENG;HUANG CHAO-NIEN |
| 分类号 |
H01L21/00;H01L21/20;H01L21/8238;H01L33/00;H01L33/30;H01L33/32;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/00 |
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