发明名称 Semiconductor device and semiconductor assembly apparatus for semiconductor device
摘要 In a semiconductor device, a plurality of linear semiconductors of a predetermined length, on which electronic element are formed, are aligned laterally and in parallel. A semiconductor assembly apparatus for assembling the semiconductor device, aligns the linear semiconductors in parallel via an arranging member. The linear semiconductors are interconnected by a connecting member in the semiconductor assembly apparatus.
申请公布号 US2003001257(A1) 申请公布日期 2003.01.02
申请号 US20020213124 申请日期 2002.08.06
申请人 JOJIKI MASAO 发明人 JOJIKI MASAO
分类号 H01L21/677;H01L21/02;H01L23/473;H01L25/065;H01L29/06;(IPC1-7):H01L23/34 主分类号 H01L21/677
代理机构 代理人
主权项
地址