| 发明名称 |
Conductive adhesive and method for the production of a microcapsule type conductive filler for the conductive adhesive |
| 摘要 |
<p>A method for the production of a microcapsule (MC) type conductive filler is provided. The method comprises (a) immersing minute conductive particles in an affinity agent thereby treating the surface of the minute conductive particles, (b) immersing and dispersing the surface-treated minute conductive particles in an epoxy monomer thereby forming a suspension, and (c) polymerizing the monomer in the suspension thereby forming a thermosetting insulating polymer on the surface of the minute conductive particles.</p> |
| 申请公布号 |
EP0783177(B1) |
申请公布日期 |
2003.01.02 |
| 申请号 |
EP19970103551 |
申请日期 |
1992.10.23 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
DATE, HIROAKI;USUI, MAKOTO;WATANABE, ISAO;HOZUMI, YUKO |
| 分类号 |
B01J13/14;C08F2/44;C08K7/00;C09J9/02;C09J11/04;H01B1/00;H01B1/22;H01L21/60;H01L23/482;H01L23/495;H01R11/01;H01R43/00;H05K3/32;(IPC1-7):H01L21/60;B01J13/18;C08F292/00 |
主分类号 |
B01J13/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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