发明名称 Using micro heat pipes as heat exchanger unit for notebook applications
摘要 A system including a plurality of micro heat pipes is used to transfer heat from a die. A die attach block is coupled with the die. The plurality of micro heat pipes (MHPs) are attached to the die attach block to enable the MHPs to be in close contact with the die to absorb heat generated by the die.
申请公布号 US2003000682(A1) 申请公布日期 2003.01.02
申请号 US20010895308 申请日期 2001.06.29
申请人 MACHIROUTU SRIDHAR V.;WALTERS JOSEPH D. 发明人 MACHIROUTU SRIDHAR V.;WALTERS JOSEPH D.
分类号 F28D15/02;H01L23/427;(IPC1-7):F28D15/00 主分类号 F28D15/02
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