发明名称 |
LEADLESS SOLDER |
摘要 |
A lead-free solder which is comprised of three elements Sn-Cu-Ni. Cu and Ni are 0.1 - 2 wt% and 0.002 - 1 wt% respectively. Preferable weight percentage of Cu and Ni are 0.3 to 0.7 percent and 0.04 to 0.1 percent respectively. Both methods of additive Ni to a base alloy of Sn-Cu and additive Cu to a base alloy of Sn-Ni are applicable. <IMAGE> |
申请公布号 |
EP0985486(A4) |
申请公布日期 |
2003.01.02 |
申请号 |
EP19990907920 |
申请日期 |
1999.03.15 |
申请人 |
NIHON SUPERIOR SHA CO., LTD |
发明人 |
NISHIMURA, TETSURO |
分类号 |
B23K35/26;B23K;C22C;C22C13/00;H05K1/09;H05K3/34 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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