| 摘要 |
<p>In a flat package for a semiconductor IC (Integrated Circuit), a substrate has internal ground wirings respectively connecting a cavity and a seal metallized portion to respective suspension leads. The suspension leads are connected to ground for a shielding purpose. With this configuration, the package eliminates the need for exclusive ground leads which would limit the number of available valid leads. In addition, a single standard type of ICs can implement various shield configurations as desired by users. <MATH></p> |
