发明名称 LASER-REPAIR EQUIPMENT USED IN EDS PROCESSING
摘要 PURPOSE: A laser-repair equipment used in an EDS(Electrical Die Sorting) is provided to prevent scratches and the breakage of a wafer by immediately sensing the alignment of the wafer. CONSTITUTION: The laser-repair equipment(100) comprises a cassette(110), a sensor(130), and a reflection plate(140). The sensor(130) is formed on the upper of the cassette(110) for sensing the alignment of a wafer(120). If the wafer(120) is normally aligned, the laser beam(150) is totally reflected from the reflection plate(140). The sensor(130) further includes a light emitting part, a light receiving part and a display part for displaying the sensing state. An LED(Light Emission Diode) is used as the display part.
申请公布号 KR20020096130(A) 申请公布日期 2002.12.31
申请号 KR20010034381 申请日期 2001.06.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, MUN SEOK
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
代理机构 代理人
主权项
地址