发明名称 |
Interconnect structure for surface mounted devices |
摘要 |
A semiconductor interconnect connection mechanism for attaching individual surface mounted semiconductor objects to multichip products whereby at least a portion of the electrical pathway between different objects on the top surface of surface mounted devices is not located on the top surface. |
申请公布号 |
US6501174(B2) |
申请公布日期 |
2002.12.31 |
申请号 |
US20010765025 |
申请日期 |
2001.01.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SEMKOW KRYSTYNA W.;PILLAI EDWARD R.;RAPP LINDA L. |
分类号 |
H01L23/498;H05K1/09;H05K1/11;H05K3/40;(IPC1-7):H01L23/34;H01L23/48 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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