| 摘要 |
PURPOSE: To overcome such a problem that multiplayer wiring structure cannot be formed and that the warpage of an insulating resin sheet in a manufacturing process is remarkable in a semiconductor device where a flexible sheet having a conductive pattern is adopted as a support substrate, a semiconductor element is mounted on the substrate, and a whole part is molded. CONSTITUTION: The insulating resin sheet where a first conductive film 3 and a second conductive film 4 are laminated by insulating resin 2 is used and a first conductive wiring layer 5 is formed by the first conductive film 3. A second conductive wiring layer 6 is formed by the second conductive film 4. Both layers are connected by a multiplayer connection means 12. The semiconductor element 7 is fixed onto overcoat resin 8 covering the first conductive wiring layer 5. Thus, multiplayer wiring structure is realized by the first conductive wiring layer 5 and the second conductive wiring layer 6. Since the second conductive film 4 formed thick exists, the warpage caused by the difference of the coefficients of thermal expansion can be prevented. |
