THERMAL EXPANSION COMPENSATION FOR MODULAR PRINTHEAD ASSEMBLY,申请号KR1020027011540-传众专利搜索

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发明名称	THERMAL EXPANSION COMPENSATION FOR MODULAR PRINTHEAD ASSEMBLY
摘要
申请公布号	KR20020097194(A)	申请公布日期	2002.12.31
申请号	KR1020027011540	申请日期	2002.09.03
申请人		发明人
分类号	B41J2/235	主分类号	B41J2/235
代理机构		代理人
主权项
地址

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