发明名称 Verfahren zum Zertrennen von grossflächigen in kleinflächigere Halbleiterplatten und Vorrichtung zur Ausführung dieses Verfahrens
摘要 <p>1,015,680. Engraving. SIEMENS SCHUCKERTWERKE A.G. Nov. 16, 1962 [Nov. 17, 1961], No. 43534/62. Heading B6J. [Also in Division H1] On large area semi-conductor plates, lines corresponding to small area plates are scored therein by an engraving machine including a tool carriage 12, Figs. 1 and 4, carrying a roller 19 rotated by a motor-driven drum 5. The axis of the roller 19 is movable in a horizontal plane by rotating a shaft 23, and when it is not parallel to the axis of the drum 5 the carriage is caused to move axially of the drum to carry the tool, a diamond 39, over the workpiece 62 clamped to a carriage 55. An arrangement mounted on the carriage 12 comprising a lever 26, Fig. 6, engaging fixed adjustable stops 8, 9 at the end of the carriage strokes and rotatable on the shaft 23, a lever 25 fixed to the shaft 23, and an over-centre spring arrangement 28a, constitute a reversal mechanism for the carriage 12. At one end of its stroke, the carriage actuates a switch to release a pawl from a rack on the carriage 55, which is then moved by a weight through the distance between two scored line positions. The tool is raised and lowered, so as to be operative only during movement in one direction, under control of an arm 33 engaged by the lever 25. The side flanks of the tool approaching the cutting edge make an angle of 140 degrees with each other. The tool is adjustable with respect to its holder before placing in the machine by means of a device described with reference to Fig. 9 (not shown). The pressure of application of the toolis 50-200 g. and the speed 0.01-0.05 m./sec. The speed of the carriage 12 is greater on the non-operative stroke.</p>
申请公布号 CH424994(A) 申请公布日期 1966.11.30
申请号 CH19620013472 申请日期 1962.11.17
申请人 SIEMENS-SCHUCKERTWERKE AKTIENGESELLSCHAFT 发明人 MEYER,AUGUST
分类号 B28D5/00;H01L21/301;(IPC1-7):H01L7/66 主分类号 B28D5/00
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