发明名称 |
Low signal loss bonding ply for multilayer circuit boards |
摘要 |
A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
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申请公布号 |
US6500529(B1) |
申请公布日期 |
2002.12.31 |
申请号 |
US20010952486 |
申请日期 |
2001.09.14 |
申请人 |
TONOGA, LTD. |
发明人 |
MCCARTHY THOMAS F.;WYNANTS, SR. DAVID L. |
分类号 |
H05K1/03;H05K3/38;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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