| 摘要 |
The method of manufacturing a semiconductor device of the present invention comprises a step of forming a titanium layer (2) on silicon-containing layers (a gate electrode (14) and an impurity layer (18)) which are formed on a silicon substrate (1); a step of forming a protective layer (3) having compression stress on the silicon substrate (1), on the titanium layer (2); and a step of forming a titanium silicide layer by reacting silicon in the silicon containing layer and titanium in the titanium layer (2) by thermal processing. The compression stress of the protective layer is preferably in the range from 1x109 Dyne/cm2 to 2x1010 Dyne/cm2. The protective layer (3) is preferably made from at least one metal selected from the group consisting of tungsten, cobalt, tantalum, and molybdenum. According to the present invention, a fine interconnecting effect is suppressed by avoiding the effect of a stress which obstructs a phase transition in the titanium silicide layer.
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