| 摘要 |
An EMI gasket exhibits enhanced compliance in the direction orthogonal to the plane of the circuit board on which a chip or chip-and-socket assembly is mounted. Therefore, the gasket may be used with chips or chip-and-socket assemblies having a variety of heights. In an embodiment, a frame made from a sheet of metal has a planar portion with an opening formed therein. The opening is adapted to fit around a perimeter of an integrated circuit chip. The sheet of metal includes top and bottom planar surfaces. Top and bottom resilient conductive members are attached to the top and bottom planar surfaces, respectively.
|
