Integrated circuit template cell system and method

摘要

A system and method are provided for forming a template cell on the input/output (I/O) surface of an integrated circuit (IC). The first metal layer of the cell includes a plurality of parallel bus lines extending from one edge of the cell to the other. A second underlying metal layer includes bus lines extending in an orthogonal direction to the first layer lines. A signal routing layer underlies the second metal layer, with a routing channel located around the edges of the cell, and ESD and output buffer circuits placed inside of the routing channel. The bus lines of the first and second metal layers, and the routing channel of the signal routing layer, have connection areas so that connections are formed by abutting the cells. Each cell also includes a flip-chip solder pad overlying the first metal layer that can be connected by a via to either the first or second metal layer.