| 发明名称 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 摘要 |
An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 mum is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.
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| 申请公布号 |
US6500564(B1) |
申请公布日期 |
2002.12.31 |
| 申请号 |
US20000641817 |
申请日期 |
2000.08.18 |
| 申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
SHIOBARA TOSHIO;ARAI KAZUHIRO;MIZUSHIMA HIDENORI;INO SHIGEKI;KIMURA YASUO;AOKI TAKAYUKI |
| 分类号 |
C08K3/00;C08G59/18;C08G59/32;C08G59/62;C08L63/00;C08L83/07;H01L23/29;H01L23/31;(IPC1-7):H01L29/12 |
主分类号 |
C08K3/00 |
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