Method for interconnecting a flat panel display having a non-transparent substrate and devices formed

摘要

A method for simultaneously forming a flat display panel and bonding to a printed circuit board is disclosed in which a silicon wafer is first supplied and then coated with an alignment layer, a multiplicity of spacers are then mounted to the wafer before it is severed into a multiplicity of dies. A frame seal is then applied to the periphery of the die, while a multiplicity of metal leads is formed on the die for electrical communication with a multiplicity of thin film transistors. A glass plate is then assembled to the silicon substrate by the frame seal, while simultaneously bonded to a printed circuit board in a bonder apparatus under pressure by utilizing a conductive material such as silver paste, an anisotropic conductive film or an isotropic conductive adhesive. The bonding of the printed circuit board to the flat panel display module occurs simultaneously with the formation of interconnections between the printed circuit board and the multiplicity of metal leads on the silicon substrate through a multiplicity of transparent electrodes formed on the glass plate of the flat panel display. The present invention novel structure allows the use of a conventional alignment apparatus such as CCD for optical alignment and a conventional bonder apparatus since a glass substrate is completely exposed and optical transmission can be achieved through the flat panel display module.