发明名称 |
Chemical-mechanical polishing pad conditioner |
摘要 |
A chemical-mechanical polishing (CMP) pad conditioner. The conditioner has a non-uniform conditioning surface with a plurality of conditioning elements. The non-uniform surface comprises a first section having a first cutting volume per unit width and a second section having a second cutting volume per unit width that is different from the first cutting volume per unit width. The difference in cutting volume may be provided by different projected widths of the individual conditioning elements, by a difference in the linear density between the two sections, or by a difference in the cutting depth. A CMP tool comprising a polishing pad, a conditioning pad having the disclosed structure, and a mechanism for moving the polishing pad relative to the pad conditioner is also provided. A method is further provided for uniformly conditioning a CMP pad using a conditioner having the structure described.
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申请公布号 |
US6500054(B1) |
申请公布日期 |
2002.12.31 |
申请号 |
US20000590576 |
申请日期 |
2000.06.08 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MA WILLIAM H.;TICKNOR ADAM D. |
分类号 |
B24B53/00;B24B37/00;B24B37/04;B24B53/12;H01L21/304;(IPC1-7):B24B1/00 |
主分类号 |
B24B53/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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