发明名称 Light emitting diode assembly with low thermal resistance
摘要 A light emitting diode assembly with low thermal resistance comprises an LED, a circuit board and a heat-dissipating substrate. The LED has a die mounted on a heat-dissipating plate and pads connected to a printed circuit board. The LED is mounted on a circuit board and a heat-dissipating substrate, whereby the thermal resistance of the LED assembly can be advantageously reduced to enhance the performance of the LED assembly.
申请公布号 US6501103(B1) 申请公布日期 2002.12.31
申请号 US20010983133 申请日期 2001.10.23
申请人 LITE-ON ELECTRONICS, INC. 发明人 JORY TOM;LEE PO-HSIEN;HSING CHEN CHEN-LUN
分类号 H01L33/64;H05K1/02;H05K1/18;H05K3/34;(IPC1-7):H01L33/00 主分类号 H01L33/64
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