发明名称 |
Light emitting diode assembly with low thermal resistance |
摘要 |
A light emitting diode assembly with low thermal resistance comprises an LED, a circuit board and a heat-dissipating substrate. The LED has a die mounted on a heat-dissipating plate and pads connected to a printed circuit board. The LED is mounted on a circuit board and a heat-dissipating substrate, whereby the thermal resistance of the LED assembly can be advantageously reduced to enhance the performance of the LED assembly.
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申请公布号 |
US6501103(B1) |
申请公布日期 |
2002.12.31 |
申请号 |
US20010983133 |
申请日期 |
2001.10.23 |
申请人 |
LITE-ON ELECTRONICS, INC. |
发明人 |
JORY TOM;LEE PO-HSIEN;HSING CHEN CHEN-LUN |
分类号 |
H01L33/64;H05K1/02;H05K1/18;H05K3/34;(IPC1-7):H01L33/00 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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