| 摘要 |
PURPOSE: To provide a reliable mounting structure which enables mounting different types of semiconductor elements, each having a different mounting method such as a wire bonding and a flip chip bonding, on a substrate with reliability. CONSTITUTION: In an electronic component mounting substrate 10 for mounting a semiconductor element 30 to be mounted by flip chip bonding and a semiconductor element 20 to be electrically connected and mounted by wire bonding, a bonding pad 14 to be connected to the semiconductor element 30 to be mounted by flip chip bonding is formed by applying a solder 18 on the surface of a pad formation section formed of an interconnection material mainly made of copper, and a bonding pad 12 to be connected to the semiconductor element 20 to be electrically connected and mounted by wire bonding is formed by applying a plating layer 16 formed of nickel plating or gold plating on the surface of a pad formation section formed of an interconnection material mainly made of copper. |
