HERMETICALLY SEALING ENCLOSURE FOR HOUSING PHOTO-SEMICONDUCTOR DEVICES AND PHOTO-SEMICONDUCTOR MODULE INCORPORATING THE ENCLOSURE

摘要

A hermetically sealing enclosure for housing photo-semiconductor devices th at reduces the heat generated in the wiring strips at the ceramic terminal mem- ber, increases the allowable current of the wiring strips in comparison with the conventional enclosures while maintaining the low power consumption, and stabilizes the output of the device in the enclosure. A photo-semiconductor module incorporating the enclosure is also offered. The ceramic terminal mem - ber is provided with a first wiring layer that comprises a plurality of wiri ng strips and that penetrates through the ceramic terminal member; two second wiring layers each of which comprises at least one wiring strip, one of whic h is connected to the first wiring layer at the outside of the enclosure, and the other of which is connected to the first wiring layer at the inside; and at least one third wiring layer that comprises at least one wiring strip and that connect s the two second wiring layers.