发明名称 ELECTROLYTIC PROCESSING DEVICE AND SUBSTRATE PROCESSING APPARATUS
摘要 There is provided an electrolytic processing device including: a processing electrode brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of the spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section for supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided.
申请公布号 WO02103771(A1) 申请公布日期 2002.12.27
申请号 WO2002JP01545 申请日期 2002.02.21
申请人 EBARA CORPORATION;KOBATA, ITSUKI;SHIRAKASHI, MITSUHIKO;KUMEKAWA, MASAYUKI;SAITO, TAKAYUKI;TOMA, YASUSHI;SUZUKI, TSUKURU;YAMADA, KAORU;MAKITA, YUJI 发明人 KOBATA, ITSUKI;SHIRAKASHI, MITSUHIKO;KUMEKAWA, MASAYUKI;SAITO, TAKAYUKI;TOMA, YASUSHI;SUZUKI, TSUKURU;YAMADA, KAORU;MAKITA, YUJI
分类号 B24B37/00;B23H3/00;B23H3/08;B23H3/10;B23H5/08;B24B37/04;C25D17/00;C25F7/00;H01L21/00;H01L21/304;H01L21/306;H01L21/3063;(IPC1-7):H01L21/306 主分类号 B24B37/00
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