A SILICA-BASED SLURRY

摘要

This invention relates to a slurry composition and a method of its preparation. In particular, the slurry composition of the present invention includes a silica wherein the silica comprises a surface modification. The silica-based slurry of the present invention is suitable for polishing articles and especially useful for chemical-mechanical planarization ("CMP") of semiconductor and other microelectronic substrates.