METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

PROBLEM TO BE SOLVED: To uniformly polish a surface of a semiconductor wafer to be polished with a high accuracy. SOLUTION: In a chemical mechanical polishing apparatus 10, a work (semiconductor wafer) 1 held by a head 32 is placed on a platen 11 and chemically and mechanically polished as rubbed with a polishing cloth 14 having a slurry 17 supplied thereinto, a high temperature cooling water passage 19 for passage of high temperature cooling water 18 is made in an intermediate zone in the vicinity of the upper surface of a base plate 12, and a central low-temperature cooling water passage 23 and a peripheral low-temperature cooling water passage 24 for passage of low temperature cooling water 22 are made at both sides thereof. A cooling water supply nozzle 28 for supplying cooling water 27 onto a polishing material surface 15 is provided at the side of a slurry supply nozzle 16. A temperature increase in a region of a platen corresponding to a work periphery is controlled to be suppressed when compared with a region of the platen corresponding to a region of the platen corresponding to a work center during chemical mechanical polishing operation, whereby the in-plane temperature distribution of the work during the polishing operation is made uniform and a polishing rate distribution for the work is made uniform.