发明名称 |
Method of attaching a leadframe to singulated semiconductor dice |
摘要 |
The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die, the lead finger of a leadframe, or both. By applying the adhesive only to identified good dice, time and material are saved over a process that applies adhesive to the entire wafer. By attaching the leadframe to the good die with a wet film, it is possible to remove the leadframe from the good die for rework if the good die subsequently tests unacceptable.
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申请公布号 |
US2002197772(A1) |
申请公布日期 |
2002.12.26 |
申请号 |
US20020231727 |
申请日期 |
2002.08.28 |
申请人 |
JIANG TONGBI;AHMAD SYED S.;MODEN WALTER L. |
发明人 |
JIANG TONGBI;AHMAD SYED S.;MODEN WALTER L. |
分类号 |
H01L21/66;H01L23/495;(IPC1-7):H01L21/44;G01R31/26 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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