| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip mounting device and a chip mounting method surely releasing a chip from a chip mounting means. SOLUTION: The chip mounting device is provided with the chip mounting means 3 provided with a suction hole 3a for vacuum-sucking the chip 1, an air pressure control means for controlling the pressure state of the suction hole 3a, and a carrying means for carrying the chip mounting means 3 to a desired position. The device sucks the chip 1 by vacuuming the suction hole 3a by the air pressure control means, connects or mounts the chip 1 to or on a prescribed position on a semiconductor substrate 2, and releases the chip 1 and the chip mounting means 3 by releasing the suction hole 3a from a vacuum state by the air pressure control means. To the chip mounting means 3, a weight part 4a helping the release of the chip mounting means 3 and the chip 1 is added. |
