发明名称 |
SINGULATION METHOD USED IN LEADLESS PACKAGING PROCESS |
摘要 |
A singulation method comprising: (a) providing a molded product including semiconductor chips attached and electrically coupled to an upper surface of a lead frame wherein a lower surface of the lead frame is exposed from the bottom of the molded product, the lead frame including a plurality of units in an array arrangement and cutting streets between the units, each unit having a die pad and leads arranged at the periphery of the die pad, a first metal layer formed on the entire lower surface of the lead frame except the cutting streets; (b) etching the lower surface of the lead frame with the first metal layer as mask such that the cutting streets are etched away to form a plurality of grooves; and (c) cutting the etched molded product along the grooves to obtain the leadless semiconductor packages.
|
申请公布号 |
US2002197826(A1) |
申请公布日期 |
2002.12.26 |
申请号 |
US20010928729 |
申请日期 |
2001.08.14 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
KIM HYEONGNO;PARK HYUNG JUN;PARK SANGBAE;LEE JUNHONG;KANG KUN-A;KIM BAE DOO |
分类号 |
H01L21/301;H01L21/48;H01L23/31;(IPC1-7):H01L21/301 |
主分类号 |
H01L21/301 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|