Highly dielectric addition type curable compositions

摘要

A highly dielectric addition type curable composition is provided comprising (A) an organopolysiloxane containing a cyanoalkyl group and a monovalent hydrocarbon group having an aliphatic unsaturated bond, (B) an organohydrogenpolysiloxane containing a cyanoalkyl group, and (C) a platinum group metal catalyst. The composition is easy to handle because of liquid despite solvent-free, less hygroscopic and effectively curable, and has a film-forming ability. The cured composition has excellent dielectric properties as demonstrated by a large dielectric constant and a low dielectric loss.