发明名称 Through hole insertion type electronic component and method of packaging same
摘要 When an electrode component is inserted into a through hole from one side and then rotated, parts of a conductive film are cut by a cutting blade Another electrode component including a chip component whose one terminal is connected to an electrode of this electrode component is inserted into the through hole from the other side. When compression bonding is applied to the both electrode components so as to be joined together, an electrode of the former electrode component and the electrode of the latter electrode component are spread within the through hole with the pressure. The spread electrode of the former electrode component contacts a portion of the conductive film that is electrically connected to a front surface wiring, and tho spread electrode of the latter electrode component contacts another portion of the conductive film that is electrically connected to a back surface wiring.
申请公布号 US2002196613(A1) 申请公布日期 2002.12.26
申请号 US20020176521 申请日期 2002.06.24
申请人 NEC CORPORATION 发明人 SEKI HIDEKI
分类号 H05K7/12;H05K1/18;H05K3/04;H05K3/30;H05K3/40;H05K3/42;(IPC1-7):H05K3/30;H05K3/32 主分类号 H05K7/12
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