发明名称 Multi-phase polishing pad
摘要 An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishing surface including a first polishing portion having a first polishing material of a first hardness for polishing a first portion of the substrate, and a second polishing portion having a second polishing material of a second hardness for polishing a second portion of the substrate. The article of manufacturer may be disposed on a rotatable, stationary, or linear platen for processing a substrate. In another aspect, a method is provided for processing a substrate, including providing a platen containing the polishing article disposed on the rotatable platen, delivering a polishing composition to the polishing article, and contacting a substrate on the polishing article.
申请公布号 US2002197946(A1) 申请公布日期 2002.12.26
申请号 US20020139112 申请日期 2002.05.02
申请人 APPLIED MATERIALS, INC. 发明人 EMAMI RAMIN;LUM ROBERT;MISHRA SOURABH
分类号 B24B37/04;B24D7/14;B24D13/14;(IPC1-7):B24D11/00 主分类号 B24B37/04
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