| 发明名称 |
Heat sink for electronic components |
| 摘要 |
A heat sink for electronic components having a heat dissipator connected to at least one electronic component and a ventilator designed to supply the heat dissipator with air. The heat dissipator includes at least one thermally conductive plate connected to the electronic component and having a plurality of openings.
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| 申请公布号 |
US2002196607(A1) |
申请公布日期 |
2002.12.26 |
| 申请号 |
US20020121177 |
申请日期 |
2002.04.12 |
| 申请人 |
AAVID THERMALLOY, LLC |
发明人 |
CAPRIZ CESARE;PATEL ASHOK |
| 分类号 |
H01L23/433;H01L23/467;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/433 |
| 代理机构 |
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代理人 |
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