| 摘要 |
The invention describes a device for producing a soldered joint between two joining partners which can be joined via a common contact surface (7), using a solder material which can be introduced between the two joining partners. The invention is distinguished by the fact that at least one joining partner (1), in the region of the contact surface (7), provides at least one recess, known as a solder reservoir (3), which faces the contact surface and into which the solder material can be introduced, and that the solder reservoir (3) is completely delimited and surrounded by the contact surface (7).
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