| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a probe carrier that has extremely high uniformity in area and shape in each probe being arranged at the probe carrier, prevents the bounce-back of probe liquid impact, and reduces frequency for requiring the recovery operation of a liquid discharge apparatus when manufacturing the probe carrier using the liquid discharge apparatus. SOLUTION: In the manufacturing method of the probe carrier where each of a plurality of types of probes is arranged on the carrier, a plurality of types of probe solutions containing a probe material that can be specifically combined with a labeled substance are discharged from the liquid discharge apparatus onto the carrier. In the manufacturing method, when the probe solutions are to be discharged, the probe solutions are discharge while satisfying the conditions where the product Re.We of Reynolds number Re [no units] and wafer number We [no units] is equal to or more than 0.26×10<5> and is equal to or less than 1.10×10<5> [no units]. |
