JOINING STRUCTURE FOR ELECTRONIC COMPONENT AND JOINING METHOD

摘要

PROBLEM TO BE SOLVED: To provide the joining structure for electronic components enabling cold joining. SOLUTION: In this joining structure for the electronic components, an indium layer 18 is formed at the joining part of one electronic component 14, and a connection terminal 16 composed of metal is formed at a part of the other electronic component 12 corresponding to the joining part of the electronic component 14. The indium metal layer 18 and the connection terminal 16 are connected by intermetallic joining.