| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip-chip mounting method not lowering connection reliability regardless of the kind of a substrate even when a chip size increases. SOLUTION: A tear bump 2, for which the length of a column 2b to the tip of the bump 2 excluding the part of a bump pedestal 2a is double or more of the diameter of a gold wire to be used, is formed on the aluminum electrode 1a of a semiconductor bare chip 1 by a wire bonder. By controlling a height at the time of mounting, soldering connection is performed from a position away from the pedestal 2a to the tip of the bump 2 by at least the wire diameter or more. |
