发明名称 |
METHOD AND APPARATUS FOR ELIMINATING WAFER BREAKAGE DURING WAFER TRANSFER BY A VACUUM PAD |
摘要 |
A method for eliminating wafer breakage during a wafer transfer process in a grinding apparatus by a wafer transfer pad and an apparatus for conducting such method are disclosed. In the method, a surface of the vacuum pad, or the wafer transfer pad, that is formed of sintered ceramic is first cleaned by contacting a rotating brush and a spray of cleaning solvent. The invention further discloses an apparatus for eliminating wafer breakage during the wafer transfer process by a vacuum pad by incorporating a pressure regulating valve situated in the vacuum conduit such that a vacuum pressure applied can be regulated at a rate not higher than 30 psi/sec. to the surface of the wafer transfer pad.
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申请公布号 |
US2002194689(A1) |
申请公布日期 |
2002.12.26 |
申请号 |
US20010886810 |
申请日期 |
2001.06.21 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO.,LTD. |
发明人 |
PAN JENG-YANG;WU CHIA-CHUN;TANG WEN-FANG;YEH SU-YU;YANG HUAI-TEI |
分类号 |
B08B1/04;B08B3/02;(IPC1-7):B08B11/02 |
主分类号 |
B08B1/04 |
代理机构 |
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主权项 |
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地址 |
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