发明名称 Structure for aligning chips in stacked arrangement
摘要 A stacked assembly includes first and second substrates and at least one alignment member. The alignment member has a relatively wide diameter body portion and a relatively narrow diameter alignment projection extending from the body portion. The body portion is mounted in a groove in the upper surface of the second substrate and the alignment projection being mounted in the groove in the upper surface of the first substrate.
申请公布号 US2002196440(A1) 申请公布日期 2002.12.26
申请号 US20010015271 申请日期 2001.12.13
申请人 STEINBERG DAN A.;JEANTILIS ARDEN 发明人 STEINBERG DAN A.;JEANTILIS ARDEN
分类号 B81C3/00;B81C99/00;H01L25/065;H01L29/06;(IPC1-7):G01B11/00 主分类号 B81C3/00
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