发明名称 |
Structure for aligning chips in stacked arrangement |
摘要 |
A stacked assembly includes first and second substrates and at least one alignment member. The alignment member has a relatively wide diameter body portion and a relatively narrow diameter alignment projection extending from the body portion. The body portion is mounted in a groove in the upper surface of the second substrate and the alignment projection being mounted in the groove in the upper surface of the first substrate.
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申请公布号 |
US2002196440(A1) |
申请公布日期 |
2002.12.26 |
申请号 |
US20010015271 |
申请日期 |
2001.12.13 |
申请人 |
STEINBERG DAN A.;JEANTILIS ARDEN |
发明人 |
STEINBERG DAN A.;JEANTILIS ARDEN |
分类号 |
B81C3/00;B81C99/00;H01L25/065;H01L29/06;(IPC1-7):G01B11/00 |
主分类号 |
B81C3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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