| 摘要 |
The invention provides a socket for testing a semiconductor package device having a plurality of to-be-tested points. The socket includes a pin board unit, a plurality of resilient members, a plurality of probe bodies, and a plurality of electroconductive elements. The pin board unit is formed with pin holes at positions corresponding to the to-be-tested points. The pin board unit is formed with a cavity for receiving the semiconductor package device. The resilient members are arranged within the pin holes, respectively. The probe bodies are inserted into the pin holes and in contact with the resilient members, respectively. Each electroconductive element has an upper section and a lower section. The upper sections are electrically connected to the resilient members, and the lower sections are exposed from the pin holes, respectively. Accordingly, when the semiconductor package device is received within the cavity, the to-be-tested points can be precisely aligned with the corresponding probe bodies, respectively.
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