| 摘要 |
PROBLEM TO BE SOLVED: To prevent articles from falling off from a gripping mechanism 7 fully even if transfer speed is increased and large force is applied to the articles in the horizontal direction. SOLUTION: A transfer apparatus 6 has a gripping mechanism 7 that raises a wafer cassette 5 by rising operation for setting to a gripping state, places the wafer cassette 5 by lowering operation, and at the same time releases the gripping state; an elevation mechanism 8 that elevates the gripping mechanism 7 to allow the gripping mechanism 7 to execute the rising and lowering operation; a horizontal movement mechanism 9 that horizontally moves the gripping mechanism 7 between a bed 2 and a semiconductor processing unit 4; and a contacting mechanism 10 that is provided in the horizontal movement mechanism 9 so that a tip section is placed at the upper section of the gripping mechanism 7, and is moved with the gripping mechanism 7 by the horizontal movement mechanism 9 horizontally. |
