发明名称 Backend metallization method and device obtained therefrom
摘要 A semiconductor device and a method of making it are described. During the formation of the semiconductor device, a hard mask is formed of an etch-resistant material. The mask prevents etchant from etching an area within a dielectric material near a conductive plug. The mask may be formed of a nitride. Conductive material is then deposited withinan etched via and is contacted with the conductive plug.
申请公布号 US2002195715(A1) 申请公布日期 2002.12.26
申请号 US20000517314 申请日期 2000.03.02
申请人 CHO CHIH-CHEN 发明人 CHO CHIH-CHEN
分类号 H01L21/768;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 主分类号 H01L21/768
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