发明名称 Antimicrobial containing solventless hot melt adhesive composition
摘要 An adhesive composition having dispersed therein a broad spectrum antimicrobial agent for use in medical applications, such as an adhesive for surgical drapes, wound dressings and tapes. The adhesive is composed of acrylic polymers, tackifiers and a preferred antimicrobial agent, diiodomethyl-p-tolylsulfone. The adhesive composition is essentially solventless and capable of application in a hot melt process while maintaining stability at elevated temperatures in the range of 275° F. to 350° F., which not only allows hot melt application, but allows for ethylene oxide sterilization under heat stress.
申请公布号 US2002197322(A1) 申请公布日期 2002.12.26
申请号 US20020202232 申请日期 2002.07.24
申请人 COX DAVID D.;LUND ROBERT E.;ANNETT LELAND W. 发明人 COX DAVID D.;LUND ROBERT E.;ANNETT LELAND W.
分类号 A61L2/16;A61B19/08;A61F13/02;A61K9/70;A61L15/46;A61L15/58;C09J5/06;C09J11/06;C09J133/08;(IPC1-7):A61K9/14 主分类号 A61L2/16
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