Bumping process

摘要

A process of forming a solder bump on a semiconductor device including vibrating a solder reservoir carrier in a vertical direction while pressure and heat are applied to the solder reservoir. An engagement surface of the solder reservoir is contacted with an engagement surface of the semiconductor device and the semiconductor device is vibrated in a horizontal direction to reflow a portion of the solder reservoir on the engagement surface. The solder reservoir carrier and the semiconductor device are moved away from each other so that additional solder is deposited and a solder column is grown on the semiconductor device. The solder column is cut off from the solder reservoir by vibrating the solder reservoir carrier in a horizontal direction to form a solder bump on the semiconductor device.