Method of polishing a film

摘要

A method of polishing a film formed on a wafer includes steps of polishing a film formed on a surface of a wafer which is chucked by a wafer chuck and set on a polishing disk, irradiating a plurality of portions of the film under polishing process with light, detecting lights reflected from the plurality of portions of the film caused by the irradiation and providing a detected signal indicative thereof, evaluating a thickness distribution of the film by processing the detected signal, and controlling a pushing pressure of the wafer chuck according to the evaluated thickness distribution under polishing process.