发明名称 Method for production of microcapsule type conductive filler
摘要 A process for producing a MC-type conductive filler includes treating minute metallic particles with a coupling agent, preparing an oil phase of the coupling agent-treated minute metallic particles and a reactive substance A, the reactive substance A directly contacting the metallic particles. Then, an aqueous phase is prepared having a reactive substance B, which is capable of reacting with the reactive substance A, dissolved in water. Thereafter, the oil phase is dispersed in the aqueous phase to form a suspension. In situ reaction of the reactive substances A and B is then caused by applying heat to the suspension or adding a catalyst to the suspension. This forms a coating of a thermosetting insulating resin on the surface of the minute metallic particles. Alternatively, the reactive substance B may not be used. A MC-type conductive filler may also be made by immersing minute metallic particles in an affinity agent, immersing and dispersing the affinity agent treated-particles in an epoxy monomer and polymerizing the monomer to form an insulating polymer on the surface of the minute metallic particles.
申请公布号 US2002197399(A1) 申请公布日期 2002.12.26
申请号 US20020143869 申请日期 2002.05.14
申请人 FUJITSU LIMITED 发明人 DATE HIROAKI;USUI MAKOTO;WATANABE ISAO;HOZUMI YUKO
分类号 H01B1/22;H01L21/60;H01L23/482;H01L23/495;H01L23/498;H05K3/32;(IPC1-7):B05D7/00 主分类号 H01B1/22
代理机构 代理人
主权项
地址