| 摘要 |
The device (1) picks up and aligns a sawframe (30) for handling and aligning silicon wafers (31). The device (1) includes at least one resiliently moveable locating arm (11) which is adapted to engage co-operably with a notch (35, 36) on the periphery of the sawframe (30) when the device (1) is moved into contact therewith. The sawframe (30) is thus urged into alignment with the device (1), and may be held in position relative to the device (1).
|
