发明名称 Naked chip motherboard module
摘要 This invention relates to a naked chip motherboard module, comprising a motherboard. The motherboard is a printed circuit board. The motherboard has a plurality of regional spaces, each regional space having a chip. All the chips can be recorded simultaneously to include functions or programs as required. Therefore, after the finished motherboard is cut in respective pieces, a plurality of chip modules can be obtained. Chip modules with high consistency can be obtained by speedy production.
申请公布号 US2002199159(A1) 申请公布日期 2002.12.26
申请号 US20010886084 申请日期 2001.06.22
申请人 DONG VINSON 发明人 DONG VINSON
分类号 H01L21/48;H01L23/13;H05K1/14;H05K1/18;H05K3/00;(IPC1-7):G06F17/50 主分类号 H01L21/48
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